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Browse Prior Art Database

Plastic Dual In Line Film Module

IP.com Disclosure Number: IPCOM000082424D
Original Publication Date: 1974-Dec-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Auletta, LV: AUTHOR

Abstract

Described is a carrier for packaging semiconductor devices in the so-called dual-in-line module lead frame package, in which the semiconductor devices are joined to a thin flexible film which is, in turn, mounted on a centrally located KOVAR* support plate to permit C-4 chip joining in such in-line packages, and to prevent C-4 thermal wear-out.

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Plastic Dual In Line Film Module

Described is a carrier for packaging semiconductor devices in the so-called dual-in-line module lead frame package, in which the semiconductor devices are joined to a thin flexible film which is, in turn, mounted on a centrally located KOVAR* support plate to permit C-4 chip joining in such in-line packages, and to prevent C-4 thermal wear-out.

Shown in the figure is a standard lead frame 10 having a plurality of lead lines 11 and a central support plate 12. The central support plate 12, which is formed of KOVAR to provide an expansion rate very nearly that of silicon, has bonded thereto a polyimide film 15 which has a plurality of metallized lines 16 disposed thereon, which lines provide connections between the lead lines 11 and the C-4 pads, not shown, on a chip 17. This chip 17 is mounted pads down and contacts the metallized lines 16 disposed on the film 15. Because the film 15 directly below the chip 17 is bonded to the centrally disposed KOVAR plate 12, thermal expansion mismatch between the chip 17 and the film 15 is minimized. * Trademark of Westinghouse Electric Corporation.

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