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Cleaning Device for High Density Integrated Circuit Package

IP.com Disclosure Number: IPCOM000082427D
Original Publication Date: 1974-Dec-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Lau, JA: AUTHOR [+2]

Abstract

There is provided a multiple step cleaning method for a circuit package in a closed container, which allows three modes of extraction and eliminates the contamination from environment and handling.

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Cleaning Device for High Density Integrated Circuit Package

There is provided a multiple step cleaning method for a circuit package in a closed container, which allows three modes of extraction and eliminates the contamination from environment and handling.

Contamination is one of the serious problems in high-density micro- electronics and is getting especially critical in liquid cooled assemblies. Most frequently occurring contaminants are fluxes. There are a number of ways to remove them such as, for example, by employing conventional "degreaser" type equipment or by dipping in successive vessels containing suitable solvents. However, parts cleaned in this way are subjected to contamination from the environment and handling by transferring from one cleaning step to another. Usually in assemblies such as stacked circuits, several steps are involved.

According to the method described here, the contamination and handling is eliminated by the use of a totally enclosed container. The circuit package or completed stack is loaded in the inner container, which is attached to an electrically operated elevating arrangement and cover sealed. The operation of the device will be evident from the description of individual steps.

Fig. 1 shows the overall view of the device. The circuit package or a deck placed in the inner container is subjected to the action of boiling solvent for a desired length of time. The vapors are returned by the reflux condenser.

In the second step s...