Browse Prior Art Database

Thermal Bonding System

IP.com Disclosure Number: IPCOM000082440D
Original Publication Date: 1974-Dec-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Schuessler, PW: AUTHOR

Abstract

This system uses an epoxy to thermally bond a module cap, i.e. cover, to a substrate on which are mounted large-scale integrated circuit chips.

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Thermal Bonding System

This system uses an epoxy to thermally bond a module cap, i.e. cover, to a substrate on which are mounted large-scale integrated circuit chips.

A typical thermal cycle for effecting the bond is shown by waveform A, with the system being effected in a vacuum and subsequently a N(2) back-filled atmosphere.

By rapidly bringing the temperature of the oven up to the cure temperature Tc of the epoxy, defects such as pin holes, "negative" fillets and seepage under the cover and, hence, resultant damage to the chip-to-module joints are mitigated.

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