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Solder Bond

IP.com Disclosure Number: IPCOM000082577D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Noth, RW: AUTHOR

Abstract

A solder bond between two thermally mismatched materials, without "oil canning" of the materials or shearing of the bond, can be realized by providing on one of the materials to be bonded, a segmented solder wet-table surface. Each segment is totally surrounded by a nonwettable ring.

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Solder Bond

A solder bond between two thermally mismatched materials, without "oil canning" of the materials or shearing of the bond, can be realized by providing on one of the materials to be bonded, a segmented solder wet-table surface. Each segment is totally surrounded by a nonwettable ring.

By providing such a nonwettable ring, stresses on the bond due to thermal expansion mismatch is greatly minimized. This segmented solder settable surface also permits the use of wider location tolerances.

Preferably the segmented pattern is hexagonal, although squares or circles can also be used.

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