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Thru Hole Metallization in Ceramics

IP.com Disclosure Number: IPCOM000082598D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Elmgren, JA: AUTHOR [+3]

Abstract

A process to provide thru-hole metallization in ceramics, and thereby provide electrical interconnection within the substrate is as follows:. 1) Dispense paste metallization into holes of the substrate; 2) Place substrate on vibration table and vibrate; and, 3) Locate substrate over vacuum ports of a substrate screener to remove excess paste from the holes, and place substrate in heated environment to dry the paste.

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Thru Hole Metallization in Ceramics

A process to provide thru-hole metallization in ceramics, and thereby provide electrical interconnection within the substrate is as follows:. 1) Dispense paste metallization into holes of the substrate; 2) Place substrate on vibration table and vibrate; and, 3) Locate substrate over vacuum ports of a substrate screener to remove excess paste from the holes, and place substrate in heated environment to dry the paste.

The dispensing operation provides a supply of conductor paste which fills the hole for only a portion of its length, due to the combined effects of viscosity and surface wettability. Due to effects of gravity and vibration, the paste is caused to flow and wet the rest of the hole leaving a portion of the hole filled. The excess paste can be removed during the subsequent screening process.

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