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Laminate Fabrication to Facilitate Laser Hole Drilling

IP.com Disclosure Number: IPCOM000082599D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Haining, FW: AUTHOR [+2]

Abstract

Core laminates with thin-copper foil on both surfaces lend themselves to laser hole drilling and electroless circuit deposition. A method of manufacturing printed-circuit card or board cores is utilized, wherein thin-copper foil is laminated to the dielectric core and functions as a mask to enable laser hole drilling of the core.

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Laminate Fabrication to Facilitate Laser Hole Drilling

Core laminates with thin-copper foil on both surfaces lend themselves to laser hole drilling and electroless circuit deposition. A method of manufacturing printed-circuit card or board cores is utilized, wherein thin-copper foil is laminated to the dielectric core and functions as a mask to enable laser hole drilling of the core.

The method basically provides laminating a dielectric core with a thin-copper layer on both sides, applying photoresist to both sides of the core laminate, exposing the hole sites, etching the hole sites, removing the photoresist, and laser drilling the holes. By further processing, the circuit lines and holes can be electroless plated to provide circuitized card or board cores.

It is essential that the core laminates be prepared with a copper foil, the thickness of which is dependent upon the circuit density. This provides a reflective surface for laser drilling, a means of adhesion for the electroless copper to be plated to the epoxy glass dielectric core, and an autocatalytic surface for the deposition of the electroless copper. If thin-copper foil is used, it is applied while attached to a heavier copper or aluminum foil. After lamination, the heavier foil is removed by peeling or etching.

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