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Browse Prior Art Database

Module Encapsulating System

IP.com Disclosure Number: IPCOM000082602D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Memis, I: AUTHOR

Abstract

This is a module encapsulation system wherein the protection is achieved by gettering environment pollutants, such as water, with materials like aluminum-oxide powder or molecular sieves. While these materials getter water in a routine fashion, they do provide good insulation protection for substrate metallurgy even when saturated with water.

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Module Encapsulating System

This is a module encapsulation system wherein the protection is achieved by gettering environment pollutants, such as water, with materials like aluminum-oxide powder or molecular sieves. While these materials getter water in a routine fashion, they do provide good insulation protection for substrate metallurgy even when saturated with water.

The inorganic powder material can be placed in direct contact with the semiconductor chip devices and the resultant benefits are: 1) environmental protection from the gettering action, 2) insulation of the surface metallurgy, and
3) enhanced heat transfer from the semiconductor chip device to the module cap.

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