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Module Top Surface Preparation Process

IP.com Disclosure Number: IPCOM000082603D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bakos, P: AUTHOR [+2]

Abstract

This is a process for top surface preparation of single or multilayer modules, and particularly adapted to enhance the electrical requirements thereof. The process utilizes vacuum deposition, standard wet process photoengraving steps, electrolytic depositions, and etching steps. The process to accomplish top surface preparation requires different metallurgies necessitating a multistep fabrication as follows: 1. Engineering change A suitable metal pattern (window frame) is deposited through a predetermined mask onto the substrate. The deposited metal must exhibit low adhesion to the surface, thereby insuring engineering change capability for delete purposes. 2. Base metallurgy The necessary metallurgies are vacuum deposited to obtain uniform thin films.

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Module Top Surface Preparation Process

This is a process for top surface preparation of single or multilayer modules, and particularly adapted to enhance the electrical requirements thereof. The process utilizes vacuum deposition, standard wet process photoengraving steps, electrolytic depositions, and etching steps. The process to accomplish top surface preparation requires different metallurgies necessitating a multistep fabrication as follows: 1. Engineering change A suitable metal pattern (window frame) is deposited through a predetermined mask onto the substrate. The deposited metal must exhibit low adhesion to the surface, thereby insuring engineering change capability for delete purposes. 2. Base metallurgy The necessary metallurgies are vacuum deposited to obtain uniform thin films. The thin film contains various metal blankets dictated by the requirements. The bottom film is selected to ensure strong adhesion between substrate and metal such as, aluminum, vanadium, titanium, chromium and tungsten. To ensure electrical conductivity, copper is deposited onto the bottom metallurgy. On copper, another metallurgy is being deposited. This metallurgy is necessary to provide the solder stop-off capability. 3. Discrete wire plane By the alterations of photoprocess, etching and electrolytic plating the wire pads are being prepared. The electrolytic depositions must be performed onto a uniform, low-resistance "cathode" to minimize current changes; thus obtaining un...