Browse Prior Art Database

Air Conveyor Wafer Transport

IP.com Disclosure Number: IPCOM000082632D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Kehagioglou, T: AUTHOR [+2]

Abstract

Fig. 1 shows a molded aluminum air conveyor wafer transport. Air is pumped into a pressure chamber 4 and forced through holes 6 in grooves 8. Molded plastic strips 10 are press fit into the grooves 8 with small air jets 12 in the plastic strips. The air jets 12 are centered directly over the holes 6 in the grooves 8 so that the air is also forced through the air jets, which propels or centers the wafer 14. The cover 16 is formed of clear plastic that fits into grooves in the wafer transport body.

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Air Conveyor Wafer Transport

Fig. 1 shows a molded aluminum air conveyor wafer transport. Air is pumped into a pressure chamber 4 and forced through holes 6 in grooves 8. Molded plastic strips 10 are press fit into the grooves 8 with small air jets 12 in the plastic strips. The air jets 12 are centered directly over the holes 6 in the grooves 8 so that the air is also forced through the air jets, which propels or centers the wafer 14. The cover 16 is formed of clear plastic that fits into grooves in the wafer transport body.

The molded plastic strip in the middle groove 18 propels the wafer. Fig. 2 is an elevational view of a central propelling plastic strip. The wafer is propelled when air is forced through the air jets 6, which faces in the direction of the wafer flow at an angle of 10 degrees to 30 degrees.

The molded plastic strips, not shown, in the two inner grooves 20, which straddle the propelling groove 18, center 2-1/4 inch wafers and the molded plastic strips 10 in the two outer grooves 22 center 3-1/4 inch wafers. Fig. 3 is a perspective view of a centering plastic strip 10. The air jet angle is 90 degrees and facing towards the wafer flow. Advantages of this air conveyor wafer transport are: 1) The use of plastic strips, which eliminates steel sheet delamination; 2) The air jets, which propel the wafer at a high velocity; 3) The wafer transports, which can be manufactured in 8 to 16 foot lengths; 4) Only one pumping station is necessary, and 5) A rel...