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Browse Prior Art Database

Wafer Centering Clamp Device

IP.com Disclosure Number: IPCOM000082642D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Gruber, LW: AUTHOR [+3]

Abstract

Shown is a wafer centering clamp device where the wafer 4 is positioned and clamped by two DELRIN* covered rollers 6 that are mounted on a rectangular yoke 8, which is spring loaded 10, and pivots below the wafer plane. The yoke 8 includes a bearing supported shaft 12 that is preloaded and clamped at one end by a jack screw 14 that adjusts the wafer rotation.

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Wafer Centering Clamp Device

Shown is a wafer centering clamp device where the wafer 4 is positioned and clamped by two DELRIN* covered rollers 6 that are mounted on a rectangular yoke 8, which is spring loaded 10, and pivots below the wafer plane. The yoke 8 includes a bearing supported shaft 12 that is preloaded and clamped at one end by a jack screw 14 that adjusts the wafer rotation.

Fluid sensors determine the arm position and an air cylinder 16 moves the clamping device out from its clamping position. The clamping device is adjusted by using a standard wafer. Also shown is the wafer notch locator pin 18.

The wafer clamping force is 5 to 10 grams with a negligible lift force when the pivot point is properly selected.

The bearing mounted rectangular yoke 8 permits a clean air environment, because there are no sliding members near the wafer line. * Trademark of E.I. du Pont de Nemours & Co.

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