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Browse Prior Art Database

Multilayer Hybrid Module

IP.com Disclosure Number: IPCOM000082702D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Mathers, MR: AUTHOR

Abstract

A multilayer hybrid module is formed by screen printing copper paste on a ceramic layer 10, totally covering one side of the ceramic. The copper is dried and fired, and a conductive pattern 12 is generated from the copper paste by photoresist and metal-etch techniques.

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Multilayer Hybrid Module

A multilayer hybrid module is formed by screen printing copper paste on a ceramic layer 10, totally covering one side of the ceramic. The copper is dried and fired, and a conductive pattern 12 is generated from the copper paste by photoresist and metal-etch techniques.

A dielectric glass 14 is screen printed in selected areas, and the glass is dried and fired. Copper conductors 16 are screen printed on the selected areas, and the copper conductors are dried and fired. Solder is then applied to the selected copper conductors 16.

Edge connectors 18 are then placed on a ceramic layer 20, and chip components 22, such as integrated circuits or capacitors are then also placed on the ceramic layer. The components 22 are soldered in place by reflow techniques, and the assembly of the ceramic layers 10 and 20 and the glass insulation layer 14 are joined, with a cover over the assembly.

With the above technique, thin-film geometries for multilayer conductor structures are made possible.

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