Browse Prior Art Database

Integrated High Precision Transducer

IP.com Disclosure Number: IPCOM000082703D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Schillinger, WE: AUTHOR

Abstract

Described is a transducer with all elements fabricated on a single block or wafer of silicon, using integrated circuit technology to achieve high precision by eliminating, or at least minimizing, hysteresis, temperature effects, spurious responses, etc.

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Integrated High Precision Transducer

Described is a transducer with all elements fabricated on a single block or wafer of silicon, using integrated circuit technology to achieve high precision by eliminating, or at least minimizing, hysteresis, temperature effects, spurious responses, etc.

Many transducers use a primary transducing element (e.g., a proving ring, Bourdon tube or diaphragm, or torsion bar) to convert the measured (e.g., force, pressure, or torque) into a linear or angular displacement (strain). This displacement is then measured by a secondary transducer (e.g., a strain gauge, or potentiometer) and amplified by a signal conditioning device, to provide a desired electrical signal.

Each of these elements limits the attainable precision. The primary elements display hysteresis, creep, zero and scale factor instability and temperature effects. The secondary transducer may have limited resolution, spurious responses due to noise, vibration, temperature and other environmental effects. The signal conditioner is usually a large item which ideally should be close to the transducer to minimize noise.

These deficiencies can be eliminated, or at least minimized, by fabricating or mounting all three types of elements (primary and secondary transducers and signal conditioners) on a single silicon block or wafer. More specifically, high- precision transducers of small size that are inherently temperature compensated or compensatible are easily made as follows:

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