Browse Prior Art Database

Electroformed Multiple Bladed Diamond Saw

IP.com Disclosure Number: IPCOM000082711D
Original Publication Date: 1975-Jan-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Mansbridge, DS: AUTHOR [+2]

Abstract

Conventional dicing saws for dicing semiconductor wafers are made up of approximately fifty 4 inch diameter stainless steel discs, interspaced with accurately machined distance pieces approximately 0.1 inch thick. The perimeters of the disc blades are coated with nickel impregnated with diamond before assembly. Unfortunately, it only requires one disc to fail after relatively few cuts to result in four lines of reject chips per semiconductor wafer.

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Electroformed Multiple Bladed Diamond Saw

Conventional dicing saws for dicing semiconductor wafers are made up of approximately fifty 4 inch diameter stainless steel discs, interspaced with accurately machined distance pieces approximately 0.1 inch thick. The perimeters of the disc blades are coated with nickel impregnated with diamond before assembly. Unfortunately, it only requires one disc to fail after relatively few cuts to result in four lines of reject chips per semiconductor wafer.

The above schematics, which are not to scale, illustrate a method of manufacturing a multibladed diamond saw having a number of advantages. In drawing A, metal hub 1 for example of 4 inch diameter is coated with insulation material 2 (for example, PERSPEX*) to a thickness of, for example 0.02 inch.

Next, as shown in drawing B, slots 3 (for example, 0.004 inch wide) are machined in insulation 2 down to hub 1. Slots 3 may be spaced 0.011 inch apart. As shown in drawing C, hub 1 is then electroplated in a nickel bath to plate up nickel blades 4 to a distance of, for example 0.002 inch from the surface of insulation 2.

The assembly is next placed in a nickel electroplating bath containing a suspension of 10 to 20 micron sized diamond particles, so as to form abrasive composite nickel-diamond surface 5.

By removing insulation 2 with a solvent, the multiple saw blade structure shown in drawing D remains. This structure has a number of advantages over the conventional saw mentioned ab...