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Flip Over Sputtering System

IP.com Disclosure Number: IPCOM000082771D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Slattery, WJ: AUTHOR

Abstract

This sputtering system includes two different cathodes and a mechanism for placing a workpiece adjacent to either cathode for performing sequential depositions. Deposition may also be performed on both sides of a workpiece without removal from the system.

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Flip Over Sputtering System

This sputtering system includes two different cathodes and a mechanism for placing a workpiece adjacent to either cathode for performing sequential depositions. Deposition may also be performed on both sides of a workpiece without removal from the system.

The sputtering system consists of two vacuum chambers, a deposition chamber and a flip-over chamber. The deposition chamber contains a single anode and two separate cathodes, one copper and one chromium although other cathodes may be used. The flip-over chamber contains a substrate sled and flip- over mechanism which permits the substrate to be removed from the deposition chamber, rotated 180 degrees and be reinserted in the deposition chamber in a position adjacent to either cathode. Deposition may also be made with the same cathode on the back side of the substrate.

The substrate holder is mounted to the flip-over mechanism by a simple hinge which allows the holder to level itself inside the anode fixture, keeping the anode and cathode parallel for more uniform deposition.

In operation, a substrate is mounted in the sled and the system is sealed. Vacuum pumps then exhaust the system to the desired base pressure. Back filling the system with an inert gas may be used if desirable. After the system has reached the desired pressure, deposition is commenced by depositing chromium, for example, on a first side of the substrate by energizing the chromium anode through its respective RF gen...