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Wafer Lead Frame Technique

IP.com Disclosure Number: IPCOM000082783D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Ward, WC: AUTHOR

Abstract

Lead frame connectors to round wafers can be readily produced by winding a ring mandrel 10 with a toroidal coil 11. The mandrel 10 is provided on its inner and outer edges with concentric adhesive coated rings 12, 13, 14, and 15. The mandrel 10 is further provided with circular recesses 16 and 17.

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Wafer Lead Frame Technique

Lead frame connectors to round wafers can be readily produced by winding a ring mandrel 10 with a toroidal coil 11. The mandrel 10 is provided on its inner and outer edges with concentric adhesive coated rings 12, 13, 14, and 15. The mandrel 10 is further provided with circular recesses 16 and 17.

The desired lead frame is made by forcing dies 18 and 19 against the round mandrel 10. Each die is provided with a boss 20 and 21 which mates with a respective recess 16 or 17, to form strain-relief loops in the final connectors.

The dies 18 and 19 also force the wire against the concentric rings 12, 13, 14 and 15. Once the wire has been formed and secured to the concentric rings, it is cut along the inner and outer edges at points 23, 24, 25, and 26 leaving two fabricated assemblies, each of which is comprised of a pair of concentric rings having a plurality of formed wires between.

These formed wires are now available for use. If desired, the wires can be previously coated with a suitable solder.

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