Browse Prior Art Database

Batch Loading of Solder Buckets

IP.com Disclosure Number: IPCOM000082794D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Johnson, RF: AUTHOR [+5]

Abstract

This is a special tool device that enables the simultaneous loading and positioning of solder buckets, and provides a means of retaining the solder buckets in proper position during subsequent assembly operations. The solder buckets can then be transferred and joined to electrical pads on a substrate or the like.

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Batch Loading of Solder Buckets

This is a special tool device that enables the simultaneous loading and positioning of solder buckets, and provides a means of retaining the solder buckets in proper position during subsequent assembly operations. The solder buckets can then be transferred and joined to electrical pads on a substrate or the like.

The device comprises three sections, 1) a solder bucket locating plate 10, 2) a vacuum plate 11, and 3) a base member 13. The solder buckets 14 are loaded in an upside down position and with the aid of vacuum and vibration come to rest on loading pins 15, which are attached to the base member 13 and protrude through the vacuum plate 11 and locating plate 10. When all solder buckets 14 have been located on the pins 15, the excess buckets 14 are removed from the fixture.

The substrate with presolder pasted pads are appropriately located on the solder buckets 14 and clamped in this position. The assembly is then placed in an oven and heated to reflow the solder, thereby joining the buckets 14 to their respective electrical pads on a substrate member or the like.

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