Browse Prior Art Database

Environmental Filter

IP.com Disclosure Number: IPCOM000082800D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Ii, LB: AUTHOR [+2]

Abstract

Environmental filter 10, Fig. 1, uses electrostatic and chemical neutralization techniques to remove contaminants and pollutants from the air flow system associated with a semiconductor wafer processing line.

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Environmental Filter

Environmental filter 10, Fig. 1, uses electrostatic and chemical neutralization techniques to remove contaminants and pollutants from the air flow system associated with a semiconductor wafer processing line.

The contaminated air is passed through an electrostatic generator 10A and an electrostatic charge is placed on the airborne particles to be removed. Generator 10A is shaped in the form of duct 11. Duct 11 is made of metal 12 such as copper or tin, which in turn is plated with a protective coating such as gold or platinum layers 13, 14, Fig. 2.

The inner surface of duct 11 is covered with an Alpha or Beta emitter layer
15. For example, a nickel-63, promethium, or protactinum layer 15 is electrically plated or molecularly deposited on the inner surface, and the high-energy particles emitted from the layer 15 provide the electrostatic charge to the airborne foreign particles which are to be removed from the airstream.

The air containing the charged particles is next passed through a combination electrostatic charged particle collector and chemical filter 10B. As detailed in Fig. 3, a pair of fine wire mesh screens 17 and 18, which are silver plated to prevent corrosion, are electrically charged to attract the oppositely charged air particles in the air stream. Located between the screens 17 and 18 is a chemical neutralizer 19 such as activated charcoal, which further removes undesirable matter and gasses such as CO(2), H(2)S, and sulfur. Th...