Browse Prior Art Database

Removable Hermetic Seal for Electronic Module Packages

IP.com Disclosure Number: IPCOM000082805D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Pittwood, DG: AUTHOR

Abstract

This hermetic seal configuration is adapted for the interface between electronic module substrates and their cooling covers, but is also applicable to numerous other packaging configurations where it is desired to provide a reliable gas-tight seal.

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Removable Hermetic Seal for Electronic Module Packages

This hermetic seal configuration is adapted for the interface between electronic module substrates and their cooling covers, but is also applicable to numerous other packaging configurations where it is desired to provide a reliable gas-tight seal.

The component parts of the seal are shown in the sketches. The flat base 10 of a cooling hat or cover 11 fits into a formed metal flange 12 attached to the substrate 13. The edge of the substrate mounting flange 12 is turned up so that it forms an annular groove or space around the base 10 of the cooling cover 11. Into this groove is pressed a disposable metal ring 14. Into the apace above the ring 14 is placed an appropriate type of sealant, i.e., epoxy, molten solder, or the like to complete the seal. A hold down clamp 15 is then installed to absorb any mechanical stress that may be imposed between the cooling cover 11 and the base plate 16 of the assembly.

For this assembly, removal of the sealant is easily accomplished by a simple tool 17 and by winding out the disposable metal ring 14, in a manner similar to the opening operation for a sardine can. This assembly provides a long-life, gas- tight seal that is easily removable to enable rework of devices within the sealed area.

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