Browse Prior Art Database

Article Transfer/Cleaning/Inspection Station

IP.com Disclosure Number: IPCOM000082850D
Original Publication Date: 1975-Feb-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Rajac, TJ: AUTHOR

Abstract

Semiconductor wafers are processed with improved yields by reduced surface contamination, during transfer/cleaning and inspection operations. An enclosed transfer apparatus permits inspection and wafer cleaning to occur in a clean atmosphere, while wafers are transferred from one carrier to another carrier.

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Article Transfer/Cleaning/Inspection Station

Semiconductor wafers are processed with improved yields by reduced surface contamination, during transfer/cleaning and inspection operations. An enclosed transfer apparatus permits inspection and wafer cleaning to occur in a clean atmosphere, while wafers are transferred from one carrier to another carrier.

The transfer cleaning and inspection station includes an enclosure 12 for receiving wafer carriers 14 and 16 at opposite ends.

A conveyor 18, typically an air track, cooperates with the carriers 14 and 16. An operator controls the carriers 14, 16 and conveyor 18. A wafer 20 is transferred by the conveyor 18 to a rotatable stage 22 beneath a view tube 24 in the enclosure 12.

A high-intensity light 26 is directed across the wafer 20 at an angle of about 3 degrees. The rotatable stage 22 can be turned full circle to permit the beam to display contaminants on the wafer surface. The operator employs a blowoff nozzle 28 to traverse the wafer 20 with a jet of nitrogen or deionizing enriched gas to remove the contaminants. A supply of clean air is provided at an opening 30 and a high-volume exhaust 32 removes the contaminated air from the station.

In operation, a vertical indexer associated with the carrier 14 aligns the wafers with the conveyor. A kicker jet 34 moves a wafer 20 onto the conveyor
18. A sequence of jets in the conveyor 18 transfers the wafer to the rotatable stage 22. A vacuum is applied to the back surface...