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Getter to Prevent Corrosion

IP.com Disclosure Number: IPCOM000082954D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Goldmann, LS: AUTHOR

Abstract

There is shown a flip-chip module structure, wherein a ceramic substrate 1 carries a semiconductor chip 3 by electrical and mechanical connections 2. A thermoplastic encapsulant, such as an amide-imide polymer 4, covers the semiconductor chip 3. A getter 5 is positioned within the encapsulant 4 above the chip 3. The getter 5 prevents or reduces corrosion of metal layers, not shown, on the substrate 1 or the connections 2.

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Getter to Prevent Corrosion

There is shown a flip-chip module structure, wherein a ceramic substrate 1 carries a semiconductor chip 3 by electrical and mechanical connections 2. A thermoplastic encapsulant, such as an amide-imide polymer 4, covers the semiconductor chip 3. A getter 5 is positioned within the encapsulant 4 above the chip 3. The getter 5 prevents or reduces corrosion of metal layers, not shown, on the substrate 1 or the connections 2.

Where the connections 2 are composed of a lead-indium alloy, the getter 5 may be composed of, for example, either a 50/50 lead/indium strip made from a flattened wire or a copper wire dip coated with 50/50 lead/indium. The getter 5 in this example reduces corrosion of the indium portion of the alloy.

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