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Metallurgical Vacuum Furnace Fluxless Chip Joining

IP.com Disclosure Number: IPCOM000082955D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Dalbo, JM: AUTHOR [+3]

Abstract

A semiconductor chip is placed onto a conductive land pattern on a substrate by hand or a chip placement machine. A solder, for example lead-tin or lead-indium, coating covers the chip terminals and the conductive land terminals. No fluxes are used on the conductive pattern or on the chip.

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Metallurgical Vacuum Furnace Fluxless Chip Joining

A semiconductor chip is placed onto a conductive land pattern on a substrate by hand or a chip placement machine. A solder, for example lead-tin or lead-indium, coating covers the chip terminals and the conductive land terminals. No fluxes are used on the conductive pattern or on the chip.

The composite structure is put into metallurgical vacuum system. The system is closed and then pumped down to a vacuum of 10/-6/ torr range Heat control is turned on to 265 degrees C for Pb/In and 350 degrees C for Pb/Sn, until solder reflow takes place. The heat is then shut off. The system is allowed to cool to 150 degrees C under vacuum before removal of the composite.

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