Browse Prior Art Database

Facedown Horizontal Position Wafer Processing

IP.com Disclosure Number: IPCOM000082964D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Htoo, MS: AUTHOR [+2]

Abstract

One technique for reducing particulate contamination of wafers during hot processing is to invert the wafer (place the wafer in a facedown position). At present, wafers are processed face up through all processes, leaving the wafer surface susceptible to particle fallout.

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Facedown Horizontal Position Wafer Processing

One technique for reducing particulate contamination of wafers during hot processing is to invert the wafer (place the wafer in a facedown position). At present, wafers are processed face up through all processes, leaving the wafer surface susceptible to particle fallout.

Particulate contamination is the major cause of yield loss and device failure, particularly for surface activated device programs. In the past, wafers were hot processed in the horizontal face-up position for glassing, in the vertical or side-on position for capsule and open-tube diffusion and oxidation, and in the horizontal facedown position for capsule diffusion. However, by using the proper introductory diffusant techniques, it has been found that wafers can be hot processed in any position.

Inverting the wafer for hot processing has an additional advantage: the wafers can be transferred using a back-side vacuum pickup instead of a front side Bernoulli pickup, thereby protecting the wafer's front side during prolonged storage on quartz boats.

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