Browse Prior Art Database

Metallurgy System for Glass Encapsulation

IP.com Disclosure Number: IPCOM000082992D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Poley, NM: AUTHOR

Abstract

In a gaseous discharge display panel, orthogonal conductor arrays are disposed on glass substrates and overcoated with a layer of dielectric, and individual cells located at the intersection of a pair of coordinate conductors are selectively energized by appropriate drive signals to produce a visible light output. The dielectric is formed by applying glass frit over the conductors and reflowing the frit, to produce a uniform layer over the conductor array. While copper conductors are preferred for their conductor properties, copper does not adhere to glass.

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Metallurgy System for Glass Encapsulation

In a gaseous discharge display panel, orthogonal conductor arrays are disposed on glass substrates and overcoated with a layer of dielectric, and individual cells located at the intersection of a pair of coordinate conductors are selectively energized by appropriate drive signals to produce a visible light output. The dielectric is formed by applying glass frit over the conductors and reflowing the frit, to produce a uniform layer over the conductor array. While copper conductors are preferred for their conductor properties, copper does not adhere to glass.

Accordingly, one solution to this problem is to use a three-layer metallurgy system including a layer of copper conductor with a layer of chrome above and below, the lower chrome layer providing adherence to the glass and the upper layer, when oxidized, protecting the copper from attack by the active glass frit dielectric.

Referring to Fig. 1, a section of a gas panel is shown as comprising substrates 3 and 5, substrate 3 having conductors comprising a chrome layer 7, a copper layer 9 and a chrome layer 11 overcoated with a dielectric layer 13. Corresponding layers are shown connected to the upper substrate 5 in which the conductors are orthogonal to the lower conductor array, corresponding conductors being identified by similar prime subscripts.

While not necessary to the present device, the dielectric layers have associated layers of refractory material 15, 15' to protect the dielectric against sputtering during operation of the panel.

Generally...