Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Protective Container for Integrated Circuit Modules

IP.com Disclosure Number: IPCOM000083006D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Capousis, J: AUTHOR [+3]

Abstract

Shown is a storage container for integrated circuit modules having a special contact grounding arrangement, for protection against damage from electrostatic discharge.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 93% of the total text.

Page 1 of 2

Protective Container for Integrated Circuit Modules

Shown is a storage container for integrated circuit modules having a special contact grounding arrangement, for protection against damage from electrostatic discharge.

Fig. 1 shows an isometric, cutaway view of the package which comprises the plastic housing 1, formed by the lid portion la and the bottom portion 1b. A filler material such as cardboard 2 takes up excess space in the bottom of bottom housing portion 1b. A first and second strip of aluminum tape 2a and 2b are attached to the inside and outside of the lid portion 1a and the bottom portion 1b of the housing, as is shown in Fig. 2. A third piece of aluminum tape 3 is attached along one side of the housing 1 so as to contact both pieces of aluminum tape 2a and 2b.

A conductive plastic foam such as VELOFOAMT 7611 4a and 4b are placed in electrical contact with the tapes 2a and 2b, within the lid portion 1a and the bottom portion 1b of the housing. A grid board 5 having an array of perforations suitable for inserting the pins of the module 6, can be placed on top of the conductive foam layer 4b.

The integrated circuit modules 6 can be placed on the surface of the grid board 5 with the electrodes thereof, contacting the conductive foam 4b, such that when the lid 1a of the housing is closed, the conductive foam 4a and the conductive foam 4b envelop the modules and connect all the electrodes thereof in common, thereby preventing damage from electrostatic di...