Browse Prior Art Database

Gas Panel Structure to Allow Direct Seals to Submerged Metallurgies

IP.com Disclosure Number: IPCOM000083087D
Original Publication Date: 1975-Mar-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Reisman, A: AUTHOR

Abstract

In the IBM Technical Disclosure Bulletin article entitled "Making Gas Panel Displays" Vol. 17 No. 10 March 1975 pages 3136 and 3137, J. Landermann et al describe a gas panel structure, wherein the hermetic edge seal of the panel is made by direct sealing to the panel metallurgy and substrate.

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Gas Panel Structure to Allow Direct Seals to Submerged Metallurgies

In the IBM Technical Disclosure Bulletin article entitled "Making Gas Panel Displays" Vol. 17 No. 10 March 1975 pages 3136 and 3137, J. Landermann et al describe a gas panel structure, wherein the hermetic edge seal of the panel is made by direct sealing to the panel metallurgy and substrate.

In some applications, a low-dielectric constant dielectric is employed as the dielectric overcoat layer. When such is used, the dielectric layer must be made very thin, e.g., from 5-10 mu m. These thin layers of dielectric create a problem in uniform coverage of the metallurgy. Moreover, it is possible that such thin layers result in a dielectric exhibiting a higher defect density than occurs in thicker layers. To obviate these problems, the metallurgy may be buried or submerged in the plate-glass substrate.

Typically, buried metallurgy in gas panel fabrication is obtained by etching grooves in the plate-glass substrate. The grooves are then backfilled with metal, so that the final metallurgy is parallel to the surface of the plate-glass. Such a structure would not be amenable to the direct seal technique proposed by Landermann et al in the above mentioned article, since any spaces in the backfilled grooves would be difficult, if not impossible, to seal by the edge seal material.

The figure shows a structure wherein the direct seal technique of Landermann et al is effective where buried metallurgy is employe...