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Method for a multicavity socket for high power delivery

IP.com Disclosure Number: IPCOM000083115D
Publication Date: 2005-Feb-28
Document File: 2 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a multicavity socket for high power delivery. Benefits include improved functionality, improved performance, and improved reliability.

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Method for a multicavity socket for high power delivery

Disclosed is a method for a multicavity socket for high power delivery. Benefits include improved functionality, improved performance, and improved reliability.

Background

      Lateral current movement through a package is a key limiter in achieving targeted load lines. The conventional approach to improving lateral power delivery is to increase the amount of Cu in the package. This approach creates a cost problem.

      Conventional sockets have a single cavity. It is used to house the required decoupling capacitors on the land side of the package. The lateral power delivery problem arises because the die sits directly over the cavity and the current has to travel across the package to get to the die (see Figure 1).

Description

      The disclosed method is a multicavity socket. Contacts are placed directly below the power delivery nodes on the die. As a result, the current can flow vertically from the board through the socket and package to the die, minimizing inefficient lateral power delivery. Cavities are placed near the power nodes to provide room for land-side capacitors on the package. The multicavity socket may have improved warpage characteristics compared to standard annular sockets due to the extra material in the center that functions as crossbracing.

      The disclosed method includes a multicavity socket. The cavities provide space for sockets with cavities and land-side capacitors....