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Method for a zero-force liquid-metal test probe for low-k wafer testing

IP.com Disclosure Number: IPCOM000083117D
Publication Date: 2005-Feb-28
Document File: 2 page(s) / 62K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a zero-force liquid-metal test probe for low dielectric constant (low-k) wafer testing. Benefits include improved functionality, improved reliability, and improved environmental friendliness.

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Method for a zero-force liquid-metal test probe for low-k wafer testing

Disclosed is a method for a zero-force liquid-metal test probe for low dielectric constant (low-k) wafer testing. Benefits include improved functionality, improved reliability, and improved environmental friendliness.

Background

      Conventional wafer testing is performed by mechanically pushing a test probe on solder bumps. The applied pressure may cause damage to the bumps and to the weak low-k interlayer dielectric (ILD) material underneath the bumps. The damage is expected to become an increasingly important reliability issue because low-k ILD layers are expected become increasingly weak.

General Description

      The disclosed method uses liquid metals, such as gallium (Ga), as test probe for testing low-k ILD wafers. The liquid metal provides electrical connection between the wafer bumps and test probe during testing. The test probe does not contact mechanically to the bumps and does not cause any damage to the wafer.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing zero-force wafer testing

•             Improved reliability due to preventing damage to the solder bumps and low-k ILD material during testing

•             Improved environmental friendliness due to recycling the Ga

Detailed description

      The disclosed method deposits a liquid metal on the test probes or on the wafer solder bumps by dippin...