Browse Prior Art Database

Method for a TAB-SCSP

IP.com Disclosure Number: IPCOM000083122D
Publication Date: 2005-Mar-01
Document File: 3 page(s) / 315K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a tape-automated-bonding stacked chip scale package (TAB-SCSP). Benefits include improved functionality and improved performance.

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Method for a TAB-SCSP

Disclosed is a method for a tape-automated-bonding stacked chip scale package (TAB-SCSP).  Benefits include improved functionality and improved performance.

Background

      The technology of reducing thickness of a folded stacked chip scale package (FSCSP) presents a design challenge. Package thickness reduction is limited to the component thickness, height, and reliability performance. Components include the following:

•             Dies

•             Adhesive

•             Substrate

•             Mold cap

•             Solder spheres

      The thinnest FSCSP package is achieved when its dies, adhesive and substrate are thin, the mold cap and wire-bond loop heights are low, and when the combination creates a package that meets the set quality and reliability requirements.

      The thickness problem is not fully solved. Engineers are continuously researching for thinner materials, such as substrates and adhesives, and exploring and evaluating thinner mold caps, lower loops, die thinning techniques, and lower ball height technology.

      Alternative solutions include Flex-SCSP (FSCSP) and micro-BGA packages. Flex-SCSP is an existing package that uses a flexible substrate, thin dies, and thin film adhesive. This solution uses wire-bonding technology and mold array technology. The mold cap and loop height are limiters in producing a thinner package (see Figure 1).

      Micro-BGA is a legacy package which uses a flexible substrate, single die, and thick film adhesive. This solution uses TAB technology and side package encapsulation...