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Alternative Passive Components in the Ball Grid Array Solder Ball Form Factor

IP.com Disclosure Number: IPCOM000083156D
Publication Date: 2005-Mar-01
Document File: 2 page(s) / 112K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses discrete components in the shape and size of a ball grid array (BGA) solder ball. Benefits include a solution that does not increase package dimensions when adding discrete components.

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Alternative Passive Components in the Ball Grid Array Solder Ball Form Factor

Disclosed is a method that uses discrete components in the shape and size of a ball grid array (BGA) solder ball. Benefits include a solution that does not increase package dimensions when adding discrete components.

Background

Currently, there are products that use discrete components in conjunction with silicon
(e.g. Flash). These products use a combination of capacitors and inductors wire bonded with the device. When adding these discrete components to the package, the overall package size increases (see Figures 1 and 2).

General Description

Figure 3 shows the disclosed method’s BGA solder ball discrete solution. By eliminating the discrete components on the substrate of silicon, the package dimensions are reduced. The discrete components are in the shape and size of the BGA solder ball, and replace the existing solder balls or are added to the solder ball array.

Advantages

The disclosed method does not increase the package dimensions when adding discrete components.

Fig. 1

Fig. 2

Fig. 3

Disclosed anonymously