Browse Prior Art Database

Stacking Larger Die Through a "T-Spacer" Concept in Stacked Chip-Scale Packaging Technology

IP.com Disclosure Number: IPCOM000083158D
Publication Date: 2005-Mar-01
Document File: 2 page(s) / 30K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a "T-spacer" to maximize the size of die that can be stacked on top of smaller die. Benefits include a solution that allows for more flexibility in the final die stack-up configuration.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 66% of the total text.

 

Stacking Larger Die Through a “T-Spacer” Concept in Stacked Chip-Scale Packaging Technology

Disclosed is a method that uses a “T-spacer” to maximize the size of die that can be stacked on top of smaller die. Benefits include a solution that allows for more flexibility in the final die stack-up configuration.

Background

Stacked Chip-Scale Packaging (SCSP) is the latest technology trend to deliver more functionality in a smaller package. Typically, a smaller die is stacked on top of larger die in the same package, and this approach is very inflexible and inconvenient for package design and manufacturability.  Alternatively, a larger die can be stacked on top of a smaller die; however, a large overhang between the large and small die will violate the package design rules (see Figure 1); large overhangs often result in die cracking.

General Description

The disclosed method uses a “T-spacer” to maximize the size of die that can be stacked on top of smaller die (see Figure 2). The “T-spacer” is composed of two spacers of different sizes in between two dies to eliminate the large overhang; the second spacer helps reduce and absorb the stress from the large overhang of the top die.

With the disclosed method, there is an increase of 17% to 50% in the maximum die size that can be stacked, depending on die thickness. The disclosed method is more critical with thinner die, because the maximum allowable overhang is very short. For example, for a 3mil die thickness, only...