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WIREBONDING INTO A VIA ENTRANCE STRUCTURE

IP.com Disclosure Number: IPCOM000083161D
Publication Date: 2005-Mar-01
Document File: 3 page(s) / 62K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses new approaches, such as wire bonding to a via entrance structure or directly wire bonding to a via land pad, to improve the wire bonding process. Benefits include improved signal integrity and increased circuit density.

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WIREBONDING INTO A VIA ENTRANCE STRUCTURE

Disclosed is a method that uses new approaches, such as wire bonding to a via entrance structure or directly wire bonding to a via land pad, to improve the wire bonding process. Benefits include improved signal integrity and increased circuit density.

Background

Currently, there is a need to improve electrical circuit density for routing in increasingly dense circuit packages. Each wirebonding feature will require many different conductive patterns to transfer signal from the wirebond pad to the ball pad; an example would be a wirebond pad, a trace to connect the wirebond pad to a via structure, the via structure itself, and a trace to connect a via structure to a ball pad, and finally the ball pad itself.

General Description

The disclosed method contains the following four approaches:

§         Wire bonding to a via entrance structure. Direct wire bonding to the via structure eliminates wire bond pad features, and improves design flexibility and routing density (see Figure 1). This approach eliminates the wire bond land pads and traces that connect the wire bond land pad to the via. The elimination of the mentioned structures will enable higher routing density due to available real estate on the substrate.

§         Direct interconnect structure between the solder bump and solder ball. Direct laser drilling to the bump pad removes the need for additional traces and via land pads
(see Figure 2). This direct laser drilling onto the bump pad enables the via formation.

§         Direct laser drilling onto a circul...