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Browse Prior Art Database

Immersion Gold on Multilayer Ceramics Modules

IP.com Disclosure Number: IPCOM000083183D
Original Publication Date: 1975-Apr-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schmeckenbecher, AF: AUTHOR

Abstract

Immersion gold plating from a cyanide containing solution, when deposited onto nickel-plated lands on a module, improves the wettability by solder, such as lead-tin, and the storage life of the nickel surface.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Immersion Gold on Multilayer Ceramics Modules

Immersion gold plating from a cyanide containing solution, when deposited onto nickel-plated lands on a module, improves the wettability by solder, such as lead-tin, and the storage life of the nickel surface.

If input/output pins, flanges, etc. are brazed to the module with a silver containing braze, any immersion gold which has been applied before the brazing, diffuses into the nickel at the brazing temperature (typically 800 degrees C), and loses the effect on the wettability of the nickel surface.

If the immersion gold is applied after the brazing, the nickel plate in electrical contact with the silver containing braze is attacked by the immersion gold solution, probably due to a galvanic effect of the silver.

The attack of immersion gold on the nickel lands is prevented and the application of immersion gold after the brazing is possible where the nickel lands, and silver braze have a coating of, for example, palladium. The module is immersed into a solution of 1 g/1 of palladium chloride and 1 ml/1 conc. HCL, which covers the silver and nickel with palladium without attacking the nickel. Immersion gold is then applied as usual.

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