Browse Prior Art Database

Resist Removal Process

IP.com Disclosure Number: IPCOM000083194D
Original Publication Date: 1975-Apr-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Barile, CA: AUTHOR [+3]

Abstract

Resist layers which have been hardened during the processing of the substrate, such as by subjecting the resist coated substrate to high-power implantation, are removed with a sequential heating and chemical stripping process.

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Resist Removal Process

Resist layers which have been hardened during the processing of the substrate, such as by subjecting the resist coated substrate to high-power implantation, are removed with a sequential heating and chemical stripping process.

A resist layer comprising, for example, a phenol-formaldehyde novolak resin and a diazo ketone sensitizer which has been hardened during ion beam bombardment of the substrate upon which it is coated, is first heated in either air or pure oxygen at temperatures of from 250 degrees C to 500 degrees C for 0.5 to 2 hours. The resist layer is then easily stripped from the substrate by treatment with an acid solution, such as 9:1 H(2)SO(4)/HNO(3) at 100 degrees C for 10-30 minutes.

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