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Nonthinning Polymer for Positive Photoresists

IP.com Disclosure Number: IPCOM000083196D
Original Publication Date: 1975-Apr-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Macy, EH: AUTHOR [+2]

Abstract

A cresol-formaldehyde novolac resin is used in positive photoresists. A resin has been developed which provides for less film thinning during resist development.

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Nonthinning Polymer for Positive Photoresists

A cresol-formaldehyde novolac resin is used in positive photoresists. A resin has been developed which provides for less film thinning during resist development.

The polymer is prepared by adding 2.104 grms of oxalic acid dissolved in 123.50 grms of 37 percent formaldehyde to 216.26 grms of cresylic acid. This mixture is then heated to reflux with vigorous stirring, the mixture is then stirred at reflux for six hours. At the end of six hours the water and formaldehyde are distilled off at atmospheric pressure.

Resin is then heated to approximately 225 degrees C with stirring and vacuum slowly applied, with full pump vacuum attained in 30 minutes. The temperature is then held at 225 degrees C with stirring and full vacuum for an additional 30 minutes before pouring the polymer melt into a tray to cool.

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