Browse Prior Art Database

Modular Heat Sink

IP.com Disclosure Number: IPCOM000083213D
Original Publication Date: 1975-Apr-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Parsapour, H: AUTHOR

Abstract

Improved heat conductivity and thermal contact between a heat sink 4 and a module 1 is obtained by using a heat pipe in the form of a bellows tube 3, which is flexible in a longitudinal direction. The condenser end of heat pipe 3 is brazed to heat sink 4, which is mounted to a circuit card 2 by screws 5 and spacers 6.

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Modular Heat Sink

Improved heat conductivity and thermal contact between a heat sink 4 and a module 1 is obtained by using a heat pipe in the form of a bellows tube 3, which is flexible in a longitudinal direction. The condenser end of heat pipe 3 is brazed to heat sink 4, which is mounted to a circuit card 2 by screws 5 and spacers 6.

The bellows, of which heat pipe 3 is made, provides some measure of elasticity to keep the evaporator end of heat pipe 3 in contact with module 1. A layer of thermal grease is used between heat pipe 3 and module 1, to keep the thermal resistance low at the evaporator end of the heat pipe.

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