Browse Prior Art Database

Component Orientation Fixture

IP.com Disclosure Number: IPCOM000083386D
Original Publication Date: 1975-May-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 3 page(s) / 65K

Publishing Venue

IBM

Related People

Butera, JJ: AUTHOR

Abstract

Illustrated are two component orientation fixtures for holding components 6 with their leads 5 in a predetermined position relative to the component, so that soldering, potting, stamping etc. or other manufacturing functions may be performed on the component. The fixture 20 illustrated in Figs. 1 and 2 differs only slightly from the fixture 20 illustrated in Figs. 3 and 4, and thus like parts have been designated with like numbers for ease of identification.

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Component Orientation Fixture

Illustrated are two component orientation fixtures for holding components 6 with their leads 5 in a predetermined position relative to the component, so that soldering, potting, stamping etc. or other manufacturing functions may be performed on the component. The fixture 20 illustrated in Figs. 1 and 2 differs only slightly from the fixture 20 illustrated in Figs. 3 and 4, and thus like parts have been designated with like numbers for ease of identification.

The carrier body 1 has bonded to its external longitudinally extending sides a retaining pad 3 of, for example, a high-friction material such as silicon rubber. Hingedly coupled to the carrier body 1 by the hinges 2 are outboard retaining plates L, also including retaining pads 3 for mating with the retaining pads on the sides of the carrier body 1.

The component body 6 includes elongated component leads 5 which extend therethrough, the body being dimensioned so that the component body 6 may sit upon the upper portion of the carrier body or upon a spacer block 8, as preferred. Closing the retaining plates 4 captures the component leads 5 intermediate the retaining pads, and a retaining spring 7 (see Figs. 2A and 2E) may be clamped over the retaining plates 4 to firmly grip the leads 5.

If it is desired that the upper portion of the leads 5 should project from the component 6, for example, for dip soldering or tying of components inside the body together, the retaining plates may be swung about their hinges 2. The spacer block 8 is then removed and the component body slid downwardly exposing the upper terminal ends of the leads 5.

For potting the component body and stamping or grinding or f...