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Self Primed and Thixotropically Stabilized Epoxy Encapsulant

IP.com Disclosure Number: IPCOM000083398D
Original Publication Date: 1975-May-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Eisenmann, DE: AUTHOR

Abstract

Described is a self-primed, thixotropically stabilized epoxy-silicone copolymer system useful for encapsulation of semiconductor modules.

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Self Primed and Thixotropically Stabilized Epoxy Encapsulant

Described is a self-primed, thixotropically stabilized epoxy-silicone copolymer system useful for encapsulation of semiconductor modules.

Adhesion of epoxy resin used as an encapsulant can be enhanced by the addition from 0.2% to 12.5% by weight of silane. An increase in adhesion to pins, ceramic surfaces, aluminum cans, and conductor metallurgy is obtained by the proper selection of silane additives to the basic epoxy resin. The addition of silane to epoxy polymer systems provides resistance to fluid flow, by the incorporation of thixotropic behavior in the polymer system.

For example, gamma-aminopropyltriethoxysilane or other amino functional silanes serve to catalyze the condensation of the alkoxy-silane groups with surface hydroxides and oxides, resulting in an internal self-priming of the surfaces to be bonded in a semiconductor module. The alkoxy groups will also react with carboxylor other alkoxy groups found in other silanes, to give a resultant cross-linkage that enhances the mechanical and processing parameters of the copolymer.

As another example, epoxy functional silanes as for example, beta 3, 4 - (epoxycyclohexyl), ethyltrimethoxy silane can be used with epoxy resins to cross- link directly with the epoxide groups, while the alkoxy group will react with amino functional alkoxy silanes to promote a self-priming silane modified epoxy copolymer system, which also exhibits enhanced viscosity o...