Browse Prior Art Database

Semiconductor Wafer Marking Through a Tape Stencil by Sand Blasting

IP.com Disclosure Number: IPCOM000083399D
Original Publication Date: 1975-May-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Corwin, KG: AUTHOR

Abstract

A process is described for identifying a wafer by marking the periphery of the wafer, using a tape stencil for masking the wafer during a sand-blasting process.

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Semiconductor Wafer Marking Through a Tape Stencil by Sand Blasting

A process is described for identifying a wafer by marking the periphery of the wafer, using a tape stencil for masking the wafer during a sand-blasting process.

The figure shows semiconductor wafers 1 positioned in the recesses 2 of the conveyer belt 3. Juxtaposed with each wafer 1 is a stencil aperture 4 in a continuous stainless steel tape 5, which moves synchronously with the belt 3. The belt 3 moves the wafers 1 and the tape 5 through a sandblast chamber whose relative position is indicated by the dotted line 6.

The sandblasting operation results in an eroded indicium on the periphery of the wafer identifying the wafer 1. The wafers can then be subsequently unloaded from the belt 3 and cleaned for further processing, and they will retain the identity eroded therein by this process

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