Browse Prior Art Database

Heat Sink

IP.com Disclosure Number: IPCOM000083409D
Original Publication Date: 1975-May-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

Straight-fin type heat sinks have been generally utilized to remove the heat from electronic components by blowing air thereover. These heat sinks must be designed so that they not only provide sufficient cooling but also keep the air flow pressure drop through the fins low enough, such that a selected fan (blower) will be able to supply the air flow.

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Heat Sink

Straight-fin type heat sinks have been generally utilized to remove the heat from electronic components by blowing air thereover. These heat sinks must be designed so that they not only provide sufficient cooling but also keep the air flow pressure drop through the fins low enough, such that a selected fan (blower) will be able to supply the air flow.

In high-performance applications, an improved heat sink is needed for removing heat from high-power components as well as high-density packaged components. Pin fin heat sinks have generally met the increased cooling requirements, however, their extremely high-air flow pressure drop characteristics generally require a higher powered fan to supply the increased air flow.

The heat sink shown has been designed for high-performance cooling. It is capable of providing high-power cooling, a suitable air pressure drop characteristic for fan selection, light weight and low-cost features. Each heat sink 10 consists of a conical-shaped stud 12 formed between straight fins 14, as shown in the figures. The conical-shaped stud 12 provides high-air turbulence flow (thermal boundary layer breaker), so that a high-heat transfer coefficient can be obtained. The integral straight fins 14 not only give more available heat transfer surface but also streamline the air flow pattern, so that low-pressure drop characteristics can be achieved. Therefore, this heat sink has the combined advantages of high-cooling ability similar to...