Browse Prior Art Database

Lead Frame Forming and Joining

IP.com Disclosure Number: IPCOM000083516D
Original Publication Date: 1975-Jun-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Audi, RD: AUTHOR [+2]

Abstract

This apparatus forms an expansion loop in a fragile multielement lead frame for semiconductor devices and inserts the elements of the lead frame into a handling soldering fixture. The soldering fixture may be used as an alignment tool for the placement of the formed lead frame on the semiconductor structure to which it is to be bonded.

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Lead Frame Forming and Joining

This apparatus forms an expansion loop in a fragile multielement lead frame for semiconductor devices and inserts the elements of the lead frame into a handling soldering fixture. The soldering fixture may be used as an alignment tool for the placement of the formed lead frame on the semiconductor structure to which it is to be bonded.

The handling fixture shown in Figs. 1 and 2 comprises a shaped hollowed out ring 11 having a plurality of recessed slots 12 in its upper surface 13. A mating die 14 is formed with a series of teeth 15 which mate with and pass through the plurality of slots 12 in surface 13. The die 14 also has selvage cutting teeth 18.

Following the formation of lead frame 16 in the desired pattern it is placed on surface 13 and the expansion loops 17 are formed in it by the teeth 15 which force the loops 17 through the slots 12. Simultaneously the selvage cutting teeth 18 cut off the inner and outer selvage to leave individual leads.

When the die 14 is removed the loops 17 are retained in the slots 12 in ring
11. The entire ring 11 can now be utilized as a frame retaining member, such that all the leads may now be handled as a unit. The ring 11 also serves as an alignment tool, to prevent twisting or misalignment of the leads during subsequent handling and soldering of the leads to the semiconductor device.

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