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Optical Locating and Notch Grinding Apparatus for Ceramic Substrates

IP.com Disclosure Number: IPCOM000083529D
Original Publication Date: 1975-Jun-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Kotrch, GS: AUTHOR [+2]

Abstract

In the manufacture of printed-circuit substrates utilizing ceramic materials, the shrinkage of the ceramic material is difficult to control during firing and the metallized pads attached to the substrate shift and change their locations in a nonuniform manner. Thus the uniformity from part-to-part is impossible to maintain. Consequently, in order to manufacture ceramic substrates using conventional methods, an average locating scheme for the metallized pad locations is necessary.

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Optical Locating and Notch Grinding Apparatus for Ceramic Substrates

In the manufacture of printed-circuit substrates utilizing ceramic materials, the shrinkage of the ceramic material is difficult to control during firing and the metallized pads attached to the substrate shift and change their locations in a nonuniform manner. Thus the uniformity from part-to-part is impossible to maintain. Consequently, in order to manufacture ceramic substrates using conventional methods, an average locating scheme for the metallized pad locations is necessary.

This is an optical locating and notch grinding apparatus for ceramic substrates, which combines optical and mechanical features to produce a simple and useful locating scheme, for positioning round ceramic substrates in a fixture to enable machining of the substrates. To position a metallized ceramic substrate 10 into a fixture, the substrate 10 is set into the approximately correct position and supported by support elements 11.

A transparent optical locating device 12 is then positioned on top of the substrate 10 and is correctly located by studs 13 and 14. Then by visually observing through the four specially shaped holes 15, if the metallized pads 16 on the substrate 10 do not appear in the correct location, the substrate 10 must be adjusted until a metal pad 16 appears in each of the four holes 15. The combination of pads 16 diameter and the holes 15 diameter enables the correct locating of the substrate 10. When th...