Browse Prior Art Database

Substrate Transport and Unload Station

IP.com Disclosure Number: IPCOM000083549D
Original Publication Date: 1975-Jun-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Heller, RO: AUTHOR [+4]

Abstract

Fig. 1 shows a substrate transport, which uses a 0.375 inch pitch timing belt with an additional thickness molded on the topside of the belt to horizontally transport substrates 4. The additional molding is selectively removed by grinding to provide the appropriate size pockets, to move the substrates between work stations.

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Substrate Transport and Unload Station

Fig. 1 shows a substrate transport, which uses a 0.375 inch pitch timing belt with an additional thickness molded on the topside of the belt to horizontally transport substrates 4. The additional molding is selectively removed by grinding to provide the appropriate size pockets, to move the substrates between work stations.

Substrates 4 can be transported a minimum of 9.00 inches with a single belt to a maximum of the user's requirements, indexed in 4.50 inch increments, by alternately transferring the substrates from a single belt 6 to a double belt 8. The side guides 10 can be adjusted to the substrate size.

There is, in addition, an unloading station 3, which takes advantage of the fact that the substrates 4 continue to move forward for a short distance after the carrier belt 8 drops away from the leading edge of the substrate; thereby providing the means for entering the unloading station 3 without additional work, handling, or mechanical contact with the substrate's upper surface.

Fig. 2 shows an unload station 3 with a buffer track 12 which directs the substrate 4 to the required position in the next work station.

Besides the advantage that the substrate's top surface is not touched during unloading, there are three other advantages to this substrate transport and unload station, which are: (1) the elimination of ceramic dust generated by ceramic touching ceramic; (2) there is continuous motion to output the substrates...