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Electron Beam Resist Developers

IP.com Disclosure Number: IPCOM000083704D
Original Publication Date: 1975-Jul-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chiu, GT: AUTHOR [+2]

Abstract

Single component developers for resist layers, comprising acrylate polymers such as polymethyl methacrylate and copolymers of methyl methacrylate with methacrylate acid, include CELLOSOLVE* acetates, CELLOSOLVES, CARBITOLS* and glymes.

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Electron Beam Resist Developers

Single component developers for resist layers, comprising acrylate polymers such as polymethyl methacrylate and copolymers of methyl methacrylate with methacrylate acid, include CELLOSOLVE* acetates, CELLOSOLVES, CARBITOLS* and glymes.

These solvents can be employed both as casting solvents, to lay down thin films of the copolymer, and as developers to develop 100 micro-inch geometry from areas of the resist layer which have been exposed to high-energy radiation, such as an electron beam, with a minimum loss of unexposed film. The developing action is due to the presence of the di-functional hydroxyl and ester and/or ether linkages in the ethylene glycol derivatives.

These solvents effectively dissolve the copolymer for casting the resist films and dissolve away the exposed portions of the resist film, which is believed to contain aldehyde decomposition products of the polymer.

These developers have been found to give good resist profiles for metal lift- off when used to develop plural layers of polymethyl methacrylate and/or copolymers of methyl methacrylate with methacrylate acid, having differing proportions of monomeric constituents. * Trademarks of Union Carbide Corporation.

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