Browse Prior Art Database

Module to Circuit Card Standoff

IP.com Disclosure Number: IPCOM000083713D
Original Publication Date: 1975-Jul-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Amaro, JM: AUTHOR [+2]

Abstract

Fig. 1 shows a standoff 4 located between a module 6 and circuit card 8. This standoff is unique because it permits fluid flow around both the standoff 4 and the module pins 10, as well as reducing pin breakage by eliminating crimping. Fluids are used to clean out corrosive fluxes, which are trapped beneath the module 6 after second level soldering.

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Module to Circuit Card Standoff

Fig. 1 shows a standoff 4 located between a module 6 and circuit card 8. This standoff is unique because it permits fluid flow around both the standoff 4 and the module pins 10, as well as reducing pin breakage by eliminating crimping. Fluids are used to clean out corrosive fluxes, which are trapped beneath the module 6 after second level soldering.

Fig. 2 shows four standoffs 4 mounted on a module 6, maintaining the proper height from the circuit card 8. Fig. 3 is a top view of the stand-off 4 and Fig. 4 is a side view of the standoff.

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