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Browse Prior Art Database

Stacking and Unstacking of Substrates

IP.com Disclosure Number: IPCOM000083733D
Original Publication Date: 1975-Jul-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Barsuhn, HE: AUTHOR [+3]

Abstract

A solderless electrical and mechanical connection of multichip substrates 1 is achieved by elongated intermediate pins 2 with a flat or oval cross section. With substrates 1 being held in place, pins 2 are introduced into longitudinally slotted cups 3 extending opposite each other from the substrate surfaces. The inner walls 4 of cups 3 ovally surround the central axis, so that a 90 degree rotation of pins 2 after introduction into cups 3 will clamp them. This ensures good electrical and mechanical contact between pins 2 and cups 3.

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Stacking and Unstacking of Substrates

A solderless electrical and mechanical connection of multichip substrates 1 is achieved by elongated intermediate pins 2 with a flat or oval cross section. With substrates 1 being held in place, pins 2 are introduced into longitudinally slotted cups 3 extending opposite each other from the substrate surfaces. The inner walls 4 of cups 3 ovally surround the central axis, so that a 90 degree rotation of pins 2 after introduction into cups 3 will clamp them. This ensures good electrical and mechanical contact between pins 2 and cups 3.

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