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Complimentary Photoresist Process for Via Protection in High Density Circuit Patterns

IP.com Disclosure Number: IPCOM000083840D
Original Publication Date: 1975-Aug-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Clark, RJ: AUTHOR [+2]

Abstract

A substrate is provided with via holes by any suitable means, followed by metallization of the substrate or only the via holes.

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This is the abbreviated version, containing approximately 100% of the total text.

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Complimentary Photoresist Process for Via Protection in High Density Circuit Patterns

A substrate is provided with via holes by any suitable means, followed by metallization of the substrate or only the via holes.

The metallized substrate is coated with a xylene soluble photoresist KTFR*. This is followed by photolithographic printing and development of a desired circuit pattern, without concern for metallized via hole protection. This structure is completely coated with an aqueous soluble film photoresist RISTON II**, whereby via holes and surfaces is covered. This resist is now printed and developed using a via mask for ultimate via protection, whereby chemical etching is feasible without damage or etching of via metallization.

A conventional stripping solvent is used to remove polymerized photoresist polymers, leaving a high density metallized circuit pattern allowing connections from plane-to-plane. * Trademark of Eastman Kodak Company ** Trademark of
E. I. du Pont de Nemours & Co.

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