Browse Prior Art Database

Lip Design for Semiconductor Processing Track

IP.com Disclosure Number: IPCOM000083867D
Original Publication Date: 1975-Aug-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Cavaleri, VJ: AUTHOR [+3]

Abstract

In semiconductor processing where substrates are moved between processing stations upon tracks, various problems arise due to the track design in that excessive numbers of dropped parts can occur, and that the track configuration may interfere with processes, such as film deposition, occurring in the area of the holding lip on the track.

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Lip Design for Semiconductor Processing Track

In semiconductor processing where substrates are moved between processing stations upon tracks, various problems arise due to the track design in that excessive numbers of dropped parts can occur, and that the track configuration may interfere with processes, such as film deposition, occurring in the area of the holding lip on the track.

Fig. 1 and 2 illustrate a lip design for a semiconductor processing track which minimizes problems due to dropped parts, and virtually eliminates any effect upon evaporation or deposition processes performed upon the substrates when upon the track.

The lip track 10 specifically utilizes spaced protrusions 12 extending from the side 14 of the track, as illustrated, for retaining the substrates within the track. The hollow or open shape of the protrusions 12 allows the evaporant cloud to cover the entire substrate part. In addition, the shape of the track 10, and particularly the end zone 16 thereof enables automatic loading, which results in significant cost saving due to increased line yield.

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