Browse Prior Art Database

Lamination Release Interface

IP.com Disclosure Number: IPCOM000083882D
Original Publication Date: 1975-Aug-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Desai, KS: AUTHOR [+3]

Abstract

A layer of polymeric material that will bond to the unfired ceramic module surface and metallurgy therein, and become an integral Part of the module, is used. This material, while holding and protecting the module surface, will also serve as a release agent from the steel die surfaces during the blanking and lamination steps, and always insure positive release of the laminated module. The release material will be an integral part of the module and so selected that it will burn off cleanly during the normal firing process.

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Lamination Release Interface

A layer of polymeric material that will bond to the unfired ceramic module surface and metallurgy therein, and become an integral Part of the module, is used. This material, while holding and protecting the module surface, will also serve as a release agent from the steel die surfaces during the blanking and lamination steps, and always insure positive release of the laminated module. The release material will be an integral part of the module and so selected that it will burn off cleanly during the normal firing process.

The release ply or lamination release interface, as it may be called, has consisted of a layer of polyamide or polyvinyl alcohol. The polymeric films bond well to the module surface, releases from the steel lamination surfaces and burns off clean during normal firing.

An alternate to the polymer release ply is a one-sided polymer coated paper with an extremely thin adhesive layer. This insures a good bond to the module and positive release from the steel lamination surfaces, while also possessing excellent burn-off characteristics besides allowing for greater porosity in the release ply, so as to insure for quick evolution of decomposition products through the entire module surface.

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