Browse Prior Art Database

Etched Dielectric Gas Discharge Panel Construction

IP.com Disclosure Number: IPCOM000083919D
Original Publication Date: 1975-Aug-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Beckerman, M: AUTHOR [+3]

Abstract

The conventional gaseous discharge display panel device comprises two glass plates having orthogonal conductors disposed thereon, the conductors having a dielectric layer formed over the conductors, the plates being edge-sealed and filled with an illuminable gas, whereby pulsing of a pair of orthogonal conductors produces a discharge and a visible light from the selected cell.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 70% of the total text.

Page 1 of 2

Etched Dielectric Gas Discharge Panel Construction

The conventional gaseous discharge display panel device comprises two glass plates having orthogonal conductors disposed thereon, the conductors having a dielectric layer formed over the conductors, the plates being edge- sealed and filled with an illuminable gas, whereby pulsing of a pair of orthogonal conductors produces a discharge and a visible light from the selected cell.

In one embodiment of such devices, chrome/copper/chrome conductors were utilized, the copper acting as the conductor, the chrome layers providing adhesion to the glass and protection of the copper from attack from the glass dielectric during the reflow operation. The multilayer metallurgy required three separate depositions, a fairly expensive, time-consuming operation. A fabrication technique directed to a single metallurgy system utilizing a dielectric etching process operates as follows:

Referring to Fig. 1, a clean float glass substrate 1 is sprayed with a dielectric glass frit which is then reflowed to form dielectric layer 3. A layer of photoresist is then applied over the dielectric surface and a negative artwork pattern is then applied, exposed to an ultraviolet light source and the photoresist developed. The upper surface is etched through the dielectric to the substrate glass using dilute perchloric acid as an etchant, and the photoresist removed to provide a circuit path such as 5 shown in the upper surface of Fig. 1.

A high-tem...