Browse Prior Art Database

Semiconductor Wafer To Frame Aligner

IP.com Disclosure Number: IPCOM000083929D
Original Publication Date: 1975-Aug-01
Included in the Prior Art Database: 2005-Mar-01
Document File: 3 page(s) / 58K

Publishing Venue

IBM

Related People

Baker, MR: AUTHOR [+2]

Abstract

The purpose of this mechanism is to align a silicon wafer on a frame, such that subsequent manufacturing operations may base the location of the wafer on mechanical detents that are part of the frame design.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 54% of the total text.

Page 1 of 3

Semiconductor Wafer To Frame Aligner

The purpose of this mechanism is to align a silicon wafer on a frame, such that subsequent manufacturing operations may base the location of the wafer on mechanical detents that are part of the frame design.

This is accomplished by employing the elements of the mechanism in Fig. 1 in the following sequence.

A frame 1 is mounted on carriage 3 so that the frame 1 detents 13 are located by pins in the carriage 3. A wafer 2 is placed on the vacuum chuck 4 and is held in place by a vacuum source through ports in the chuck. A transparent wafer transfer mechanism 5 is lowered on slide 8 until it is positioned above but not touching the wafer 2.

Sighting thru the transfer mechanism 5, the hair lines on the underside of this hollow, transparent disk are aligned with reference points on the wafer 2 by adjusting the position of vacuum chuck 4. The vacuum chuck 4 is mounted on an X/Y table 9 and is also adjustable for azimuth corrections.

When the wafer 2 is properly aligned with the hair lines on the wafer transfer mechanism 5, the wafer transfer mechanism 5 is lowered to contact the top surface of wafer 2. The vacuum source to the vacuum chuck 4 is cut off and a vacuum source is provided to orifice 7 inside the hollow transfer mechanism 5. This vacuum source retains the wafer 2 against the underside of the transfer mechanism 5 thru ports on its lower surface.

The transfer mechanism 5 is raised with the wafer 2 adhering to its lower surface, to a position level with slide 10.

Carriage 3 with wafer frame 1 mounted thereon, is moved in slide 10 so that ...